In the past, the processors used in electronic products were prefabricated by big brands, but in recent years, companies including Apple and Google have begun to develop their own processing chips to match the characteristics of the products. TSMC saw this and formed the 3DFabric Alliance, hoping to help customers develop chips more easily.
The 3DFabric alliance announced earlier by TSMC aims to enhance cooperation with key partners and provide advanced packaging technology development tools, allowing chip designers to more quickly apply the latest packaging technology to their designs. The members of the alliance include different areas in the chip development process, and they will have early access to TSMC’s 3DFabric three-dimensional silicon stacking process technology, as well as advanced packaging technology and so on.
TSMC said that although advanced packaging technology is strong, developers still need the cooperation of a broad ecosystem to make the best products. Their newly formed alliance will allow 3DFabric to play on more chips. The V-Cache technology of the Milan-X and Ryzen 7 5800X3D processors that AMD launched this year is based on the 3DFabric design.