by According to the latest news, SONY has completely changed the internal design of its PS5. According to previous news, the machine has been listed in some markets on September 15.
It turns out that the new version not only upgrades the internals, including a new motherboard, a smaller and lighter heatsink, but also swaps the host for a newer processor. According to Angstronomics, the third-generation PS5 console, codenamed “CFI-1202,” comes with a smaller processor called “Oberon Plus.”
It is worth noting that this processor is manufactured using TSMC’s 6nm process, which is the same generation as the 7nm node that has been used in the PS5 “Oberon” SoC.
Although the new PS5 uses a 6nm process, both have the same design and have not made any changes to the processor configuration, including the API. That said, neither the underlying Zen2 CPU nor the RDNA2 GPU part has changed.
The design and specifications of the Oberon Plus are exactly the same as the 7nm Oberon, but the processor is smaller and the power consumption is lower. Compared with the original 300mm², it has been reduced to 260mm², so the new version of PS5 also only needs a slightly less cooling solution. Can.
For AMD and SONY, it also means that they can make more processors with a single wafer, so the production cost of the new version of the host may be a little lower. Unsurprisingly, the Xbox series, also based on the 7nm AMD SoC, will also be updated to a 6nm design in the future.
