The State Intellectual Property Office of China recently announcedHUAWEIA new patent “mirror, photolithography device and its control method” (CN115343915A). This patent is related to EUV lithography machines. This is undoubtedly good news for HUAWEI, and the outside world has begun to speculate that HUAWEI is going to start developing its own lithography machine to get rid of its dependence on ASML.
As we all know, due to the US ban, HUAWEI’s Kirin processor was frustrated. Therefore, Huawei’s entry into the lithography machine can be said to be good news. If it succeeds, it is speculated that Huawei will promote the development and design of processors in the future.
At present, China’s chip and lithography machine manufacturing capabilities are far behind the world’s advanced level. Taking the chip manufacturing process as an example, the world’s most advanced TSMC has been able to mass-produce 5nm process chips, while China’s most advanced Chip International can only mass-produce chips with a 14nm process, and there is a gap of 3 generations in the middle.
Although HUAWEI realized the importance of self-developed chips very early, and invested huge sums of money to establish a Hisilicon semiconductor chip research and development department, if the chips cannot be mass-produced, it is only talk on paper. Now the release of patents related to lithography machines may bring new progress to chip self-development.
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